BGA Syringe Tin Solder Paste Leaded Sn63pb37

$16.95

BGA Syringe Tin Solder Paste Leaded Sn63pb37
BGA Syringe Tin Solder Paste Leaded Sn63pb37

$16.95

Anyone who sellers must include it included in their kits!

SMARTES Design

A new and improved technical service, this distinctive chemical formula delivers an excellent wetting that ensures the highest reliability. It is adapted to the repair of mobile phones and the computer digital services industry, and the high-precision BGA and SMT soldering processes to solder printed circuit boards.

PCB/BGA DEEDIZIERT
Quality and high-end, with a unique formula, flawless performance, simple to weld the solder joint. It is bright and complete, no welding or false welding.

BGA Syringe Tin Solder Paste Leaded Sn63pb37

Widely applicable

The residue is clear and colorless It is not a problem for the ability to detect it, and has a remarkable cleaning capability. The use of energy thixotropy agent as well as preheating collapse special solders provide high pressure and a perfect pattern.

ReVOLUTIONARY DURABILITY

Wetting, anti-dry and relatively long shelf-life at ambient temperature. Unique, high-quality solder paste Fine and versatile packaging (10 CC/support) with a filigree look.

BGA Syringe Tin Solder Paste Leaded Sn63pb37

What is Solder Paste?

  • Solder paste is a brand new kind of solder paste that has SMT.
  • Solder paste is an intricate system that consists of an adhesive, solder powder flux, and various other ingredients.
  • At normal temperatures the solder paste is of an optimum viscosity, and the electronic component is able to initially stick to a specific location.
  • At the time of soldering the soldered component as well as the circuit board will be soldered by evaporation of the solvent as well as some other additives (permanent connections).

Method of preservation:

  • The solder paste must be kept between 1-10 .
  • Prior to opening the solder paste, the temperature of the solder paste must be raised
  • The ambient temperature (25 degree C) is able to be increased and the fallback time for temperature is usually 3-4 hours.
  • The solder paste is recommended to be used for a minimum of 6 months.
  • The solder paste must not be left in the sun.

BGA Syringe Tin Solder Paste Leaded Sn63pb37

Precautions:

  • Make sure to use a good airflow.
  • The solder paste has Organic solvent. Continue the process of contact your skin. Should the paste of solder ends up onto your skin clean it away with alcohol then wash it thoroughly by rinsing it off with water.
  • Avoid contact with your eyes.
  • Beware of children.

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SKU: 46673 Category: